ASI's thin-device manufacturing capability is based on Semiconductor-on-Polymer™ advanced packaging--making the thinnest devices possible.
American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices possible. As the leader in ultra-thin device technology, ASI provides a complete range of services for thin electronic system manufacturing. ASI's extensive thin-device expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing. American Semiconductor operates as a service provider for advanced packaging of thin device ICs, physically flexible FleX-ICs, and flexible hybrid electronics components and systems from concept to fabrication. It offers a complete suite of engineering and manufacturing services that enables clients to realize their product. It supports all aspects of IC design, FleX Silicon-on-Polymer flexible wafer processing, and Flexible Hybrid Systems design, and manufacturing. IC & ASIC services include design, verification, layout, foundry selection, foundry management, and test.
Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
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Feb 15, 2017 | Angel | — | 1 | — | — | Detail |
Investor Name | Lead Investor | Funding Round |
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Keiretsu Forum | — | Angel |