American Semiconductor

company

About

ASI's thin-device manufacturing capability is based on Semiconductor-on-Polymer™ advanced packaging--making the thinnest devices possible.

  • 11 - 50

Details

Last Funding Type
Angel
Industries
Electronics,Manufacturing,Semiconductor
Founded date
Nov 1, 2001
Number Of Employee
11 - 50
Operating Status
Active

American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices possible. As the leader in ultra-thin device technology, ASI provides a complete range of services for thin electronic system manufacturing. ASI's extensive thin-device expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing. American Semiconductor operates as a service provider for advanced packaging of thin device ICs, physically flexible FleX-ICs, and flexible hybrid electronics components and systems from concept to fabrication. It offers a complete suite of engineering and manufacturing services that enables clients to realize their product. It supports all aspects of IC design, FleX Silicon-on-Polymer flexible wafer processing, and Flexible Hybrid Systems design, and manufacturing. IC & ASIC services include design, verification, layout, foundry selection, foundry management, and test.

Funding Rounds

Number of Funding Rounds
Total Funding Amount
1
American Semiconductor has raised a total of — in funding over 2 rounds. Their latest funding was raised on Feb 15, 2017 from a Angel round.
Announced Date Round Money Raised Number of Investors Lead Investors Post Valuation
Feb 15, 2017 Angel 1 Detail

Investors

Number of Lead Investors
Number of Investors
1
American Semiconductor is funded by 1 investors. Keiretsu Forum are the most recent investors.
Investor Name Lead Investor Funding Round
Keiretsu Forum Angel