Teyan Semiconductor

company

About

Teyan Semiconductor is a rare semiconductor advanced packaging equipment company in China.

Details

Last Funding Type
Series A
Industries
Machinery Manufacturing,Manufacturing,Semiconductor
Founded date
Jan 1, 2017
Operating Status
Active

Taiyan Semiconductor is a semiconductor process and equipment service provider in the field of advanced packaging. It provides customers with advanced packaging production lines such as SiP, Fanout, Chiplet, 3D, etc. Laser (laser) + Plasma (plasma) + Sputter (coating) complete composite process and Process application equipment.

Funding Rounds

Number of Funding Rounds
Total Funding Amount
1
Teyan Semiconductor has raised a total of — in funding over 2 rounds. Their latest funding was raised on Apr 28, 2022 from a Series A round.
Announced Date Round Money Raised Number of Investors Lead Investors Post Valuation
Apr 28, 2022 Series A 1 Vinno Capital Detail

Investors

Number of Lead Investors
Number of Investors
1
1
Teyan Semiconductor is funded by 1 investors. Vinno Capital are the most recent investors.
Investor Name Lead Investor Funding Round
Vinno Capital Yes Series A